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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
! Caution
Continued from the preceding page.
3-2. A soldering iron with a tip of ?3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the re-work.
3-3. Solder wire with ?0.5mm or smaller is required for
soldering.
C02E.pdf
Sep.25,2013
<Applicable to KR3/KRM Series>
4. For the shape of the soldering iron tip, refer to the figure
on the right.
Regarding the type of solder, use a wire diameter of
?0.5mm or less (rosin core wire solder).
How to Apply the Soldering Iron
17
R0.5
Tip of Soldering Iron
Tip temperature: 350°C or less/
5 sec. or less/60W or less
26
(in mm)
Apply the tip of the soldering iron against the lower end of
the metal terminal.
1) In order to prevent cracking caused by sudden heating of
Copper Land
Apply the tip of the soldering iron only
the ceramic device, do not touch the ceramic base directly.
2) In order to prevent deviations and dislocating of the chip,
do not touch the junction of the chip and the metal
terminal, and the metal portion on the outside directly.
Appropriate Amount of Solder
The amount of solder for corrections by soldering iron,
should be lower than the height of the lower side of the chip.
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
6. Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the
Wire Solder
[Not Recommended]
on the terminal portion, without touching
the body of the chip.
Cross Section
Peeling
pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide backup pins on the back side of the PCB to
prevent warping or flexing. Install backup pins as
close to the capacitor as possible.
1-2. Avoid vibration of the board by shock when a
test-probe contacts a printed circuit board.
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that causes bending
or twisting the board.
1-1. In cropping the board, the stress as shown at right
may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the
[Recommended]
[Bending]
[Twisting]
Backup Pin
Test-probe
Test-probe
insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
Continued on the following page.
148
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GRM43DR61E106MA12L
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